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Device- and Process Characterization

SPICE - Modelling

Integrated MOS-Transistors

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DC-Measurement of integrated MOS-transistors and extraction of the model parameters for simulation models

Picture 1: DC-Measurement of integrated MOS-transistors and extraction of the model parameters for simulation models

DC-Measurement and modelling
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The picture 1 shows a comparison of an fitted MOS-model (EKV-model with lines) with the measurement dates of an 0.65um process (dots). Because of the geometry control included in MOS-models, the represented model fit of one geometry (width=3um, length=3um) is to repeat and ensure on every other geometry. In the case of high quality demands on the geometry control (e.g. analog applications) an test wafer have to provide up to 15 transistors for both channel types with different length and width. The following picture shows a width- and length-partitioning for an CMOS-transistor-pair, which considers the demands of extracting the geometry control parameters. top

Assessment structures and AC-measurement on integrated MOS-transistors

Picture 2: Width- and length-partitioning in an assessment system:

geometries for assessmentsystem

For determination of the AC-parameters, additional test structures are required to carry out CV-measurements (among other things). top

Offer for integrated MOS-transistors:


DAnalyse GmbH
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